Know About Integrated Circuit (IC) In Mobile Devices

IC or Integrated Circuit - It is an Semi Conductor Chip which is made up of different types electronic components. Resistor, Capacitor, Di...

IC or Integrated Circuit -
It is an Semi Conductor Chip which is made up of different types electronic components. Resistor, Capacitor, Diode & Transistor are a part of it. Germanium and Selicon are used in the making of IC.



Note - IC does not have a Coil or a Transformer.

ICs which are used in mobile devices are -
  1. Pin IC (Two Side & Four Side)
  2. BGA IC (Ball Grid Array) IC
  3. PGA IC (Pin Grid Array) IC
Nowadays BGA ICs are used more often since it takes lesser space as compared to others.

Pin Counting In Pin IC -
In this IC look towards the top corner side and you'll see a dot symbol, the counting from 01 begins from this dot symbol and to count the rest of the pins go in anticlockwise direction.




Ball Grid Array IC -
In this type of IC we count the Balls in the form of Rows and Columns, similar to the way we specify the location of a cell in Microsoft Excel.



Note - There isn't a way to check the Ok condition of IC via Multimeter. The working of IC specify it's Ok Condition.
If the IC is faulty then you must do a HRC (Heat Reball/Resold Change) on it.

There are different types of ICs -


Network ICs - RF IC
IF IC
FEM MODULE
HAGAR IC
HELGO IC
MJOINER IC
VINKU IC
HINKU IC
Power IC - Power Supply
Power Management
C.CONT
RETU
AVILMA
Ringer IC - Audio Amplifier IC
Melody IC
Buzzer Driver
Interface IC
Charging IC - CHAPS
TEHVO
BETTY
CPU - UPP
MAD
RAP
OMAP
HAIEN
PFO - PA

Identification of ICs -

CPU - 
  • This is the biggest IC in any mobile PCB (Printed Circuit Board) as compared to other ICs. 
  • In some of the handsets there is a golden line all around the CPU IC.
  • In some of the Nokia BB5 Category handsets there are two CPUs which are - OMAP, RAP.
Power IC -
  • There are many NPC (Non-Polarized Capacitors) around this. This also has a RTC along it's side.
  • In some of the Nokia BB5 Category handsets there are two Power ICs which are - Retu IC(also known as Avilma IC) and Tehvo IC(also called Betty IC)
Note: Some of the handsets does not have an individual Power IC as it's already integrated with the CPU.

Charging IC -
  • There are LVR around Charging IC.
  • This is placed near to the Battery Connector or Charging Jack.
Network IC -
  • There are Oscillator Crystal and BPF (Band Pass Filter) near to this IC.
  • In some of the Nokia BB5 Category handsets there are two Network ICs which are - Hinku IC and Vinku IC.
Note: Some of the handsets does not have an individual Network IC as it's already integrated with the CPU.

Audio IC -
  • It gives supply to Speaker, Microphone and Hands-free.
  • Earlier it has been used individually in Nokia DCT3 category handsets but after that it was combined with the CPU or Power IC. Hence the work of Audio IC is now been done by the CPU or Power IC.
  • Nowadays Audio Codec IC is being used in the smartphones.
Interface IC (Multimode IC) -
  • This gives supply to Ringer, Vibrator and Light.
  • Earlier it has been used in Nokia DCT3 category handsets and used to be of 20 pins. However now this one is also combined with the Power IC.
UEM (Universal Energy Management) IC -
  • This IC has been used in Nokia DCT4 and WD2 category handsets.
  • This IC has been made by combining 4 ICs which are - Power IC, Charging IC, Audio IC, Interface IC,
  • There are LVR, RTC and many of the NPC near this IC.
Bluetooth IC -
  • There is an white colour antenna pad and two colour coil near this IC.
  • This mostly comes in a glass body.
  • In some of the handsets a wire is used instead of antenna pad.
Apart from this in some of the Nokia, Motorola and Sony Ericsson models a glass IC has been used such as: SIM IC, Keypad IC, Display IC etc.


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